Conductive ink refers to ink that is printed on non-conductive substrates to enable it to conduct current and eliminate the accumulation of static charge. It is generally printed on non-conductive substrates such as plastic, glass, ceramics, or cardboard. There are many printing methods, such as screen printing, letterpress printing, flexographic printing, gravure printing, and lithographic printing. Different printing methods can be selected according to the requirements of the film thickness, and the resistance, solder resistance and abrasion resistance are also different according to the film thickness. Conductive inks can be divided into structural and filled types according to their different structures. The conductive inks currently used in the electronics industry are mainly composite conductive inks. The conductive fillers used are generally inorganic fillers such as gold, silver, copper, nickel Carbon black, graphite, carbon fiber, etc., and the binder resin is usually selected from phenolic resin, epoxy resin, polyurethane and so on. Among them, epoxy resin is widely used in conductive polymers because of its excellent performance and cheap raw materials. However, it also has disadvantages such as high viscosity, brittleness, low elasticity, and poor impact resistance. Therefore, it is necessary to modify and toughen it. Interpenetrating polymer network (IPN) is a new field of polymer modification. The compounding and blending of polyurethane and epoxy resin to form an IPN system has been the subject of much research in recent years. The IPN structure can combine the high elasticity of polyurethane with the good heat resistance and adhesiveness of epoxy resin through forced mutual capacity and synergistic effect to achieve a good toughening effect. I use isocyanate-terminated polyurethane as a toughening agent. Through the reaction of terminal isocyanate groups with the secondary hydroxyl groups on the epoxy resin, a flexible ether bond is introduced on the epoxy resin, thereby improving the toughness of the epoxy resin, and using the modified ring Oxygen resin is added to conductive filler to make conductive ink. In terms of its application, it can be applied to flexible circuits and RFID. The flexible circuit is a key component to realize the multi-function, integration, miniaturization and low cost of electronic information products. With the development of electronic products and equipment in the direction of light, thin, small, low cost, multi-function, high reliability, etc., the amount of flexible circuits is increasing. The use of conductive ink or conductive ink by printing or printing The formation of conductive lines on an insulating substrate has attracted wide attention. The test shows that the modified epoxy resin-based conductive ink has good adhesion, and the printed conductive circuit has a bending resistance of 10,000 times, which meets the requirements of flexible printed circuits. RFID is an electronic tag that is expected to replace barcodes, and is composed of an antenna and a microchip. However, in the promotion process, the development is hindered due to the lack of economical technology. The low-cost tag antenna printed with new conductive ink is low Cost packaging technology will promote the mass production of RFID tags, and will become one of the key factors that determine the development speed of the industry for a period of time in the future. I used modified epoxy resin as the connecting material, conductive carbon black and conductive graphite as the conductive filler, plus an appropriate amount of curing agent, solvent and dispersant to prepare the modified epoxy resin-based conductive ink, and performed its performance Research and apply it to RFID, the advantages of antennas will become more and more prominent. 1. Preparation of connecting material and ink 1. Preparation of polyurethane prepolymer First add polyethylene glycol to the three-necked flask, then heat and vacuum dehydrate for 1 hour, wait for it to cool and then fill with nitrogen to protect, maintain the internal temperature of 80 ℃, as soon as possible add stoichiometric TDI, TDI and the molar amount of polyethylene glycol The amount ratio is 1.2: 1, and the reaction is stopped after stirring for 4 hours, that is, the isocyanate-terminated polyurethane prepolymer is obtained, and cooled to room temperature for use. The NCO content measured by the di-n-butylamine method was 5%. 2. Synthesis of polyurethane modified epoxy resin IPN Add epoxy resin to the three-necked flask and stir again. While stirring, add ethylene glycol ether acetate (CAC) until the epoxy resin is completely dissolved. Then maintain the internal temperature at 70 ℃ and add a stoichiometric polyurethane prepolymer , The mass ratio of epoxy resin: prepolymer is 9: 1, the reaction time is 2h, and finally the polyurethane modified epoxy resin IPN is obtained. 3. Preparation of modified epoxy resin-based conductive ink First mix conductive carbon black and conductive graphite with a mass ratio of 3: 2, then add polyurethane-modified epoxy resin IPN (the mass ratio with the mixture is 6:25), then add a small amount of curing agent (polyurethane resin), solvent (Cyclohexanone) and dispersant (FA-196) were ground in a grinder for 30 minutes to obtain a modified epoxy resin-based conductive ink. Second, the detection of conductive ink 1. Curing behavior of modified epoxy resin-based conductive ink Differential scanning thermal analysis (DSC) was performed with a Perkin Elmer DSC-7 thermal analyzer. The atmosphere was static air, which was heated and solidified. The heating rate of DSC was 10 ℃ / min, and the temperature range was 35 ～ 180 ℃. 2. Flexible circuit board bending resistance The bending resistance of the modified epoxy resin-based conductive ink printed circuit was tested with a TOS-817 swing test machine. Measure the length of the conductive line 2.4 cm, width 0.9 mm, thickness 3 μm, measure 5 parallel values, and take the average value. The experimental parameters are as follows: swing angle: 180 °; swing speed: 60 times · min-1; swing number: 10000 times; temperature: 28 ° C, relative humidity: 80%. 3. Modified epoxy resin-based conductive ink printed circuit line adhesion Stick the 3M600 # adhesive tape on the cured printed sample line, the conductive line is 10cm long, 0.9mm wide, and 3μm thick, ensure that the long side of the adhesive tape is parallel to the direction of the conductive line, and use the advanced drawing rubber to wipe it flat After leaving for 1 minute, pull the tape quickly and vigorously, observe whether the tape and the sample line have a film layer, and measure the resistance change of the line before and after adhesion. Five parallel values ​​are measured for each conductive line and the average value is taken. 3. Conclusion An isocyanate-terminated polyurethane prepolymer synthesized by the reaction of 2,4-toluene diisocyanate and polyethylene glycol, which is used for the modification of epoxy resin, and the modified epoxy resin is used as the binding material, conductive carbon black, conductive graphite As a conductive filler, plus an appropriate amount of curing agent, solvent and dispersant, the modified epoxy resin-based conductive ink prepared by testing shows that the modified epoxy resin-based conductive ink has good adhesion, and the printed conductive line resists The bendability reaches 10,000 times.
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